All Special Issues

• Ongoing Special Issues
• Completed Special Issues

Thermal Management of AI Chips and Data Centers: From Fundamental Transport to Advanced Cooling Technologies

• Prof. Xin Qian, Prof. Bai Song, Prof. Guimei Zhu
• Submission Deadline: 31 Jan 2027
• Published Articles: 0

Recent Advances in Bio-thermophysics: Innovations and Development at the Intersection of Biology and Thermal Science

• Prof. Wei Rao, Prof. Jing Liu
• Submission Deadline: 30 Jun 2026
• Published Articles: 1