Twist engineering of nanoscale thermal transport

Twist engineering of nanoscale thermal transport

Wenjiang Zhou
1,2,#
,
Fuwei Yang
1,3,4,#
,
Shuangdui Wu
2
,
Bai Song
1,2,*
*Correspondence to: Bai Song, National Key Laboratory of Advanced Micro and Nano Manufacture Technology, Peking University, Beijing 100871, China; School of Mechanics and Engineering Science, Peking University, Beijing 100871, China. E-mail: songbai@pku.edu.cn
Thermo-X. 2026;2:202621. 10.70401/tx.2026.0026
Received: May 18, 2026Accepted: July 29, 2026Published: July 30, 2026
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This manuscript is made available in its unedited form to allow early access to the reported findings. Further editing will be completed before final publication. As such, the content may include errors, and standard legal disclaimers are applicable.

Abstract

Thermal transport at the nanoscale is fundamentally important and crucially impacts a range of applications from electronic chip cooling to advanced energy technology. Inspired by the rise of twistronics, twist engineering has recently emerged as a powerful approach to control nanoscale heat flow, which leverages interlayer rotation in van der Waals materials as a new degree of freedom. Here, we first briefly introduce the basic principles of twist engineering. Subsequently, we discuss various experimental techniques and computational approaches for investigating phonon-mediated heat conduction, together with key results and physical mechanisms for the active manipulation of both out-of-plane and in-plane transport. Furthermore, we review advances in the twist-induced modulation of photon-mediated thermal radiation, distinguishing strategies that tune intrinsic optical responses from those utilizing extrinsic couplings. We conclude with remarks on the opportunities and challenges for future exploration of twist-engineered thermal management and energy conversion.

Keywords

Twist engineering, heat conduction, thermal radiation, phonon dynamics, van der Waals materials

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Zhou W, Yang F, Wu S, Song B. Twist engineering of nanoscale thermal transport. Thermo-X. 2026;2:202621. https://doi.org/10.70401/tx.2026.0026

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