This work investigates the transport of an electron bubble near the free surface of superfluid ³He-B under applied electric and magnetic fields. Based on a theoretical framework combining the quasiclassical Green’s function and the Lippmann–Schwinger equation, we have calculated the scattering cross section and mobility of the electron bubble, together with their temperature and depth dependences. An electric field shifts the position of the electron bubble and thereby tunes its coupling to the surface bound states. The surface density of states decays with depth, whereas the transport cross section increases with energy and depth; these competing trends compensate, resulting in a nearly depth-independent mobility consistent with the linear dispersion of the surface states. In contrast, an applied magnetic field opens a Zeeman gap in the surface-state spectrum, which breaks the linear dispersion of the bound states. Our results demonstrate that external electric and magnetic fields provide effective control of the spectral structure and scattering properties of the surface bound states.

Driven by the escalating chip-level heat flux demands of artificial intelligence and high-performance computing, thermal management has emerged as a critical bottleneck for next-generation microelectronic integration. To address the prominent contradiction between the limited space and the high heat flux in silicon interconnect fabric chips, this research has overcome the key challenge of miniaturizing traditional spray cooling by designing and implementing an ultra-thin spray cooling heat sink embedded in a silicon-based test chip. The core advancement stems from a synergistic integration of topology-optimized micro-nozzle architecture and silicon-based microfabrication, achieving a total spray module thickness of merely 3.5 mm and enabling uniform near-field atomization from four nozzles under low pressure. Experimental results demonstrate that the heat sink removes 614 W at a junction temperature of 92 °C from a compact footprint of 9.5 mm × 9.5 mm, yielding a peak surface heat transfer coefficient of 9.03 W/(cm²·K). This performance not only validates the feasibility of spray cooling in ultra-thin packaging architectures, but also presents one of the first experimental demonstration of the monolithic integration of a spray cooling system with a silicon-based integrated circuit. This work establishes a viable pathway for ultra-high heat flux thermal management under extreme spatial constraints, enabling the practical deployment of spray cooling in high-power-density electronics, including high-performance computing and artificial intelligence chips.