Special Issue Information

With the rapid development of electronics and the Internet of Things, thermal management has attracted extensive research attention. Thermal management encompasses multi-scale heat conduction, interfacial thermal matching and dynamic heat dissipation across electronics and energy systems, and fundamentally relies on high-performance thermal management materials and devices. Thermal management materials focus on modulating intrinsic thermal properties, with recent advances centering on flexible, durable composites with ultra-high or ultra-low thermal conductivities. Thermal management devices integrate functional thermal materials to deliver practical thermal regulation, represented by precise temperature control. The advancement of thermal management materials and devices is critical for suppressing electronic thermal failure and mitigating long-term performance degradation, thereby ensuring the reliable operation of modern electronics and energy equipment.

This Special Issue aims to gather and highlight the latest breakthroughs, research advances and future outlooks regarding the rational structural design, scalable fabrication, advanced characterization and interdisciplinary applications of advanced thermal management materials and devices. We hope to stimulate innovation in this field by diving into novel thermal management material and device design theories and fabrication methodologies, interfacial thermal resistance mechanisms, anomalous heat transfer behaviors, thermal failure evolution mechanisms in thermal management systems, and novel thermal management applications. The topics of this special issue include, but are not limited to the following:
(1) Novel synthesis and interface modification strategies for high/low-thermal-conductivity materials;
(2) Passive thermal dissipation materials, devices and their advanced applications;
(3) Novel thermal management material and device applications, such as for extreme-temperature electronic equipment in aerospace and deep-sea scenarios;
(4) Passive or active thermal management solutions for electrochemical energy storage systems, such as batteries and supercapacitors;
(5) Thermally conductive modified separators, electrode coatings and packaging materials for high-safety energy storage devices;
(6) Artificial intelligence-based theories and methodologies for thermal performance prediction and structural optimization of thermal management materials and devices.

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